Design engineers are increasingly turning to 3D ICs to keep pace with the ascent of next-generation AI scaling.

The Global 2D Materials Market is projected to grow at a CAGR of 15.8% from 2026 to 2033, according to a new report published by Verified Market Reports®. The report reveals that the market was valued ...

GaN-, and silicon-based power transistors, modules, and other basic building blocks for more robust, efficient, and ...

Dan D’Agostino Master Audio Systems has announced the launch of the Momentum Z Monoblock Amplifier at $125,000 per pair amd ...

ZHUHAI, GUANGDONG, CHINA, January 21, 2026 /EINPresswire.com/ -- Environmental responsibility has transitioned from ...

For decades, optical inspection has been the primary method for process control in fabs. However, the move to multi-level ...

Nvidia Corporation earnings estimates rise as the stock stalls, compressing multiples. Click for this NVDA earnings preview ...

SanDisk stock jumped 1,561% in 12 months driven by severe HBM shortages for AI infrastructure. Q2 revenues hit $3B (up 61% YoY) with earnings of $6.20 per share (5x increase). One of the things that ...

As demand for data center compute accelerates, power efficiency has become the defining metric for modern CPUs, GPUs, and AI ...

Although [Jamie’s Brick Jams] has made many far more complicated motor design in the past, it’s nice to go back to the basics ...

Think of an application for SiC power electronics and you’ll probably think of electric vehicles (EVs). After all, it’s the battery-powered automobile that’s driving the growth in sales of SiC MOSFETs ...

High-speed hydrogen-free encapsulation using FCVA deposition improves OLED moisture barrier performance, preserves TFT stability, and nearly doubles flexible device lifetime compared with ALD.