In this paper, we presented a CMOS microbolometer design integrated with a linearity readout circuit using 0.18µm CMOS process. The air-bridge microbolometer was designed with polycrystalline silicon ...

Ultrasonic imaging has become a very promising technology, and it has been widely applied in biomedicine, geology, and other fields due to its advantages of safety, nondamaging, and real time.

In this paper, the radiated emission of a microcontroller integrated circuit is investigated by rotating the test board in a transverse electromagnetic (TEM) cell measurement. The dependence of the ...

The increasing demand for ultra-wideband wireless communications has pushed requirements of integrated circuits (ICs) to terahertz band. Operation in the terahertz band requires ultra-high efficiency ...

Integrated power converters suffer from overheating when they operate under extreme conditions. To prevent destructive breakdown an over-temperature protection (OTP) circuit is usually designed along ...

The following topics are dealt with: receivers for 2G and 3G applications; wireless data system IC and architecture; 40 Gb/s optical communications integrated circuits; RF VCOs; novel small signal ...

THz Interconnect holds the potentials to solve long-standing interconnect issues by leveraging the advantages of both electronics and optics sides due to its unique spectrum position. To support ...

Due to the complex manufacturing process of Flexible Integrated Circuit Packaging Substrates (FICS), existing detection methods are difficult to detect all of defects. In this paper we propose an ...

This paper introduces a complete simulation model of a direct power injection (DPI) setup, used to measure the immunity of integrated circuits to conducted continuous-wave interference. This model ...

Static Random Access Memory (SRAM) is a critical component in modern micro-architectures, playing a pivotal role in Application-Specific Integrated Circuits (ASICs) and Systems on Chip (SoCs). This ...

The integrated circuit packaging testing technology is highly demanding, and the task is arduous. The existing sorting efficiency of integrated circuit packaging testing is low, and it is difficult to ...

In this paper, the flip chip joints formed by using gold (Au) stud on commercial-off-the shelf (COTS) monolithic microwave integrate circuit (MMIC) designed for wire bond assembly are evaluated. This ...