Manufacturing giant Atlantic Packaging launched a venture capital and innovation arm (aka New Earth Ventures or NEV).

OpenAI Samsung chip partnership takes a major step as OpenAI Korea GM Harrison Kim confirms joint production and research ...

Driven by booming AI‑led innovation, advanced packaging evolution and global supply‑chain realignment, the electronics manufacturing industry is undergoing profound transformation, with Asia ...

AI chip substrate packaging reached a new milestone Wednesday as LG Innotek unveiled its first 100mm-class FC-BGA sample for ...

Huawei Kirin 9050 Pro launches with LogicFolding 3D chip architecture in the Mate XT 2 tri-fold, claiming 55% transistor ...

Positron AI has raised $875 million in Series C financing at a $5 billion post-money valuation to bring its next-generation ...

The Reno-based startup, which uses commodity memory instead of scarce HBM, raised the round in two tranches led by NEA and ...

Beyond emerging technologies, C-TOUCH & DISPLAY SHENZHEN 2026 will cover the broader display and touch ecosystem, including Mini/Micro LED, OLED, commercial displays, automotive displays, smart ...

OpenAI is pushing deeper into custom AI silicon, and Samsung may be playing a growing role in its chip ambitions. According ...

SK Hynix breaks ground on $4B Indiana plant, plans $54T Korea fabs, and boosts buybacks to $170B as AI memory demand surges.

SWLABEL details its advanced manufacturing of HP Indigo label stock, focusing on material engineering, topcoat technology, adhesives, and rigorous quality control for digital printing.

Samsung Foundry HBM4 capacity allocation hits 50 to 60 percent internally, with more than 15,000 wafers per month at ...