Samsung Electro-Mechanics (SEMCO) and Amkor Technology have partnered to develop a 2.5D Integration 'H-Cube' solution specialized for semiconductors for HPC, AI, data center, and network products.
Samsung has announced the availability of its HybridSubstrate Cube dubbed the H-Cube earlier today, November 11. This is the South Korean tech company's latest 2.5D semiconductor packaging option.
With eWeLink CUBE, legacy computers, Raspberry Pi, or NAS can become a Zigbee-to-Matter smart home local hub. SHENZHEN, ...
SEOUL, Korea--(BUSINESS WIRE)--Samsung Electronics, a world leader in advanced semiconductor technology, today announced that it has developed Hybrid-Substrate Cube (H-Cube) technology, its latest ...
Axis Communications announced Cube Access as an International Integration Partner, enhancing its cloud-based access control and surveillance solutions. Being recognized as an International Integration ...
New research paper titled “Review of Bumpless Build Cube (BBCube) Using Wafer-on-Wafer (WOW) and Chip-on-Wafer (COW) for Tera-Scale Three-Dimensional Integration (3DI)” from researchers at Tokyo ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results