LG Innotek announced on the 10th that it has successfully developed a ‘next-generation smart IC (integrated circuit) substrate’ that enhances performance while reducing carbon emissions by half ...

Rising memory prices are creating fresh cost challenges for IC design firms, particularly those producing chips with embedded ...

PSD@5KM+ expands ecosystem with co-working and talent development; 2nd batch of tech collaborators onboarded to expand IC ...

Taiwan's integrated circuit (IC) design industry ranks second worldwide, trailing only the US. However, in recent years, Taiwan's position has become increasingly precarious due to rapid advancements ...

A new technical paper titled “Die-Level Transformation of 2D Shuttle Chips into 3D-IC for Advanced Rapid Prototyping using Meta Bonding” was published by researchers at Tohoku University.