Modern semiconductor manufacturing technology has advanced rapidly. Because of this, measurement using non-contact displacement and transparent coating thickness has become very critical. Applications ...
During lapping, a spinning abrasive surface is used to thin wafers from the backside. As the process progresses, precise feedback is required to monitor the amount of material removed and determine ...
Sponsored by Vitrek, LLCReviewed by Maria OsipovaSep 18 2025 Wafer lapping is a vital semiconductor thinning operation that requires precise control to avoid over-removal of material, which can result ...
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