A new technical paper titled “Hybrid surface pre-treatments for enhancing copper-to-copper direct bonding” was published by researchers at National Chung Hsing University (NCHU) and Osaka University. ...
Fab processes are optimizing for cleanliness, planarity, and high bond quality. Nanotwinned copper and SiCN PVD enable lower anneal and deposition temperatures for HBM. A thin, protective layer helps ...
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